Lead-free Solder Assembly: Impact and Opportunity
نویسنده
چکیده
There has been major interest in Lead-free soldering within the electronics assembly industry for the last several years, and this will continue with the agreement on the language and implementation dates of the WEEE/ROHS legislation in the EU. This paper will focus on several topics critical to the implementation of lead-free soldering. These topics include the impact of Tin-silver-copper as the alloy of choice for leadfree assembly both with respect to component and solder joint reliability, temperature exposure, and lead-free finishes. Results from the recently completed NEMI Lead-free Solder Project, the author’s own work and other published data are discussed.
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